Gate structure having a dielectric gate and methods thereof

ABSTRACT

A semiconductor structure includes a fin active region extruded from a semiconductor substrate; and a gate stack disposed on the fin active region. The gate stack includes a gate dielectric layer and a gate electrode disposed on the gate dielectric layer. The gate dielectric layer includes a first dielectric material. The semiconductor structure further includes a dielectric gate of a second dielectric material disposed on the fin active region. The gate dielectric layer extends from a sidewall of the gate electrode to a sidewall of the dielectric gate. The second dielectric material is different from the first dielectric material in composition.

BACKGROUND

An integrated circuit is formed on a semiconductor substrate andincludes various devices, such as transistors, diodes, and/or resistors,configured and connected together to a functional circuit. Especially,the integrated circuit further includes field-effect transistors, suchas metal-oxide-semiconductor FETs (MOSFETs) or complimentary MOSFETs,wherein each includes a gate electrode to control the channel region ofthe corresponding FET. When a semiconductor device such as a MOSFET isscaled down through various technology nodes, high k dielectric materialand metal are adopted to form a gate stack. However, in a method to formmetal gate stacks for n-type MOS (nMOS) transistors and p-type MOS(pMOS) transistors, various issues may arise when integrating theprocesses and materials for this purpose. For example, when a metal gateis formed through gate replacement, there is insufficient line-endprocess window since the gate dielectric layer is also formed on thesidewalls, leaving less opening to fill in with the metal or metalalloy. Furthermore, the profile of the metal gate stack is dependent onthe layout of the gate-cut feature and the dielectric gate. This affectsthe threshold voltage and saturation current, and causes the variationof the device performance. Therefore, it is therefore desired to have anew device structure and the method making the same to address the aboveconcerns with enhanced circuit performance.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a flowchart of a method making a semiconductor structurehaving a multi-fin structure constructed according to various aspects ofthe present disclosure in some embodiments.

FIG. 2 is a sectional view of a semiconductor structure at a fabricationstage constructed according to some embodiments.

FIG. 3A is a top view of the semiconductor structure of FIG. 2 at asubsequent fabrication stage constructed according to some embodiments.

FIG. 3B is a sectional view of the semiconductor structure of FIG. 3Aalong the dashed line AA′, constructed according to some embodiments.

FIGS. 4A, 5A, 6A, 7A, 8A, 9A, 10A, and 11A are top views of thesemiconductor structure at various fabrication stages constructedaccording to some embodiments.

FIGS. 4B, 5B, 6B, 7B, 8B, 9B, 10B, and 11B are sectional views of thesemiconductor structure along the dashed line AA′ at respectivefabrication stages constructed according to some embodiments.

FIGS. 4C, 5C, 6C, 7C, 8C, 9C, 10C, and 11C are sectional views of thesemiconductor structure along the dashed line BB′ at respectivefabrication stages constructed according to some embodiments.

FIGS. 12A and 13A are top views of the semiconductor structure atvarious fabrication stages constructed according to other embodiments.

FIGS. 12B and 13B are sectional views of the semiconductor structurealong the dashed line AA′ at respective fabrication stages constructedaccording to other embodiments.

FIGS. 12C and 13C are sectional views of the semiconductor structurealong the dashed line BB′ at respective fabrication stages constructedaccording to other embodiments.

FIG. 14 is a top view of the semiconductor structure constructedaccording to some embodiments.

FIG. 15 is a top view of the semiconductor structure constructedaccording to other embodiments.

FIG. 16 is a top view of the semiconductor structure constructedaccording to some embodiments.

FIG. 17 is a top view of the semiconductor structure constructedaccording to other embodiments.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof various embodiments. Specific examples of components and arrangementsare described below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. For example, if the device in the figures is turned over,elements described as being “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the exemplary term “below” can encompass both an orientation ofabove and below. The apparatus may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein may likewise be interpreted accordingly.

The present disclosure provides various embodiments of a semiconductorstructure formed on a semiconductor substrate. The semiconductorstructure includes various devices, such as field-effect transistors(FETs) having metal gate stacks with the gate dielectric layer of ahigh-k dielectric material and the gate electrode of metal or metalalloy. The semiconductor structure further includes dielectric gates andgate-cut features integrated with the metal gate stacks. Thesemiconductor structure is formed by the disclosed method with enhancedprocess window and improved device performance.

FIG. 1 is a flowchart of a method 100 for fabricating a semiconductorstructure having fin-type transistors and metal gate stacks constructedaccording to some embodiments. FIGS. 2 through 17 are top or sectionalviews of a semiconductor structure 200 at various fabrication stages.The semiconductor structure 200 and the method 100 making the same arecollectively described below with reference to FIGS. 1 through 17.

Referring to FIG. 2, the method 100 begins with block 102 by providing asemiconductor substrate 202. The semiconductor substrate 202 includessilicon. In some other embodiments, the substrate 202 includesgermanium, silicon germanium or other proper semiconductor materials.The substrate 202 may alternatively be made of some other suitableelementary semiconductor, such as diamond or germanium; a suitablecompound semiconductor, such as silicon carbide, indium arsenide, orindium phosphide; or a suitable alloy semiconductor, such as silicongermanium carbide, gallium arsenic phosphide, or gallium indiumphosphide.

The semiconductor substrate 202 also includes various doped regions suchas n-well and p-wells. In one embodiment, the semiconductor substrate202 includes an epitaxy (or epi) semiconductor layer. In anotherembodiment, the semiconductor substrate 202 includes a buried dielectricmaterial layer for isolation formed by a proper technology, such as atechnology referred to as separation by implanted oxygen (SIMOX). Insome embodiments, the substrate 202 may be a semiconductor on insulator,such as silicon on insulator (SOI).

Still referring to FIG. 2, the method 100 proceeds to an operation 104by forming shallow trench isolation (STI) features 204 on thesemiconductor substrate 202. In some embodiments, the STI features 204are formed etching to form trenches, filling the trenches withdielectric material and polishing to remove the excessive dielectricmaterial and planarize the top surface. One or more etching processesare performed on the semiconductor substrate 202 through openings ofsoft mask or hard mask, which are formed by lithography patterning andetching. The formation of the STI features 204 are further describedbelow in accordance with some embodiments.

In the present example, a hard mask is deposited on the substrate 202and is patterned by lithography process. The hard mask layers include adielectric such as semiconductor oxide, semiconductor nitride,semiconductor oxynitride, and/or semiconductor carbide, and in anexemplary embodiment, the hard mask layer include a silicon oxide filmand a silicon nitride film. The hard mask layer may be formed by thermalgrowth, atomic layer deposition (ALD), chemical vapor deposition (CVD),high density plasma CVD (HDP-CVD), other suitable deposition processes.

A photoresist layer (or resist) used to define the fin structure may beformed on the hard mask layer. An exemplary resist layer includes aphotosensitive material that causes the layer to undergo a propertychange when exposed to light, such as ultraviolet (UV) light, deep UV(DUV) light or extreme UV (EUV) light. This property change can be usedto selectively remove exposed or unexposed portions of the resist layerby a developing process referred. This procedure to form a patternedresist layer is also referred to as lithographic patterning.

In one embodiment, the resist layer is patterned to leave the portionsof the photoresist material disposed over the semiconductor structure200 by the lithography process. After patterning the resist, an etchingprocess is performed on the semiconductor structure 200 to open the hardmask layer, thereby transferring the pattern from the resist layer tothe hard mask layer. The remaining resist layer may be removed after thepatterning the hard mask layer. An exemplary lithography processincludes spin-on coating a resist layer, soft baking of the resistlayer, mask aligning, exposing, post-exposure baking, developing theresist layer, rinsing, and drying (e.g., hard baking). Alternatively, alithographic process may be implemented, supplemented, or replaced byother methods such as maskless photolithography, electron-beam writing,and ion-beam writing. The etching process to pattern the hard mask layermay include wet etching, dry etching or a combination thereof. Theetching process may include multiple etching steps. For example, thesilicon oxide film in the hard mask layer may be etched by a dilutedhydrofluorine solution and the silicon nitride film in the hard masklayer may be etched by a phosphoric acid solution.

Then etching process is followed to etch the portions of the substrate102 not covered by the patterned hard mask layer. The patterned hardmask layer is used as an etch mask during the etching processes topattern the substrate 202. The etching processes may include anysuitable etching technique such as dry etching, wet etching, and/orother etching methods (e.g., reactive ion etching (RIE)). In someembodiments, the etching process includes multiple etching steps withdifferent etching chemistries, designed to etching the substrate to formthe trenches with particular trench profile for improved deviceperformance and pattern density. In some examples, the semiconductormaterial of the substrate may be etched by a dry etching process using afluorine-based etchant. Particularly, the etching process applied to thesubstrate is controlled such that the substrate 202 is partially etched.This may be achieved by controlling etching time or by controlling otheretching parameter(s). After the etching processes, the active regions206 are defined on the substrate 102.

One or more dielectric material is filled in the trenches to form theSTI feature 204. Suitable fill dielectric materials includesemiconductor oxides, semiconductor nitrides, semiconductor oxynitrides,fluorinated silica glass (FSG), low-K dielectric materials, and/orcombinations thereof. In various exemplary embodiments, the dielectricmaterial is deposited using a HDP-CVD process, a sub-atmospheric CVD(SACVD) process, a high-aspect ratio process (HARP), a flowable CVD(FCVD), and/or a spin-on process.

The deposition of the dielectric material may be followed by a chemicalmechanical polishing/planarization (CMP) process to remove the excessivedielectric material and planarize the top surface of the semiconductorstructure. The CMP process may use the hard mask layers as a polishingstop layer to prevent polishing the semiconductor layer 202. In thiscase, the CMP process completely removes the hard mask. The hard maskmay be removed alternatively by an etching process. Although in furtherembodiments, some portion of the hard mask layers remain after the CMPprocess.

Referring to FIGS. 3A and 3B, the method 100 proceeds to an operation106 by forming the fin structure 206 having multiple fin active regions(or fin features). FIG. 3A and FIG. 3B are a top view and a sectionalview along the dashed line AA′ of the semiconductor structure 200,respectively. The operation 106 includes recessing the STI features 204such that the fin active regions 206 are extruded above from the STIfeatures 204. The recessing process employs one or more etching steps(such as dry etch, wet etch or a combination thereof) to selectivelyetch back the STI features 204. For example, a wet etching process usinghydrofluoric acid may be used to etch when the STI features 204 aresilicon oxide. Exemplary fin active regions 206 are spaced from each ina first direction (X direction). The fin active regions 206 haveelongated shape and oriented along a second direction (Y direction),which is orthogonal with the X direction. In alternative embodiments,the fin active regions 206 are formed by epitaxial growth with one ormore semiconductor material, such as silicon and silicon germanium. Inother embodiments, the fin active regions 206 are formed by acombination of etching to recess the STI features 204 and epitaxiallygrowing the semiconductor material selectively on the active regions.

Various doping processes may be applied to the semiconductor regions toform various doped wells, such as n-wells and p-wells at the presentstage or before the operation 106. Various doped wells may be formed inthe semiconductor substrate by respective ion implantations.

Referring to FIGS. 4A, 4B and 4C, the method 100 proceeds to anoperation 108 by forming dummy gate stacks 208 on the fin active regions206. FIG. 4A is a top view; FIG. 4B is a sectional view along the dashedline AA′; and FIG. 4C is a sectional view along the dashed line BB′ ofthe semiconductor structure 200, in portion, constructed in accordancewith some embodiments. Some features are skipped for simplicity. Forexamples, the substrate 102 is not shown in FIGS. 4A-4C; and the STIfeatures 204 are not shown in FIG. 1A. In the present embodiment, thegate stacks 208 include five exemplary gate stacks as illustrated inFIG. 4C. The dummy gate stacks 208 have elongated shapes and areoriented in the X direction. Each of the dummy gate stacks 208 isdisposed over one or more fin active regions 206.

The dummy gate stacks 208 may each include a gate dielectric layer and agate electrode over the gate dielectric layer. The gate dielectric layerincludes a dielectric material, such as silicon oxide and the gateelectrode includes a conductive material, such as polysilicon. Theformation of the dummy gate stacks 208 includes depositing the gatematerials (including forming silicon oxide and polysilicon in thepresent example); and patterning the gate materials by a lithographicprocess and etching. A hard mask layer 210 may be formed on the gatematerials and is used as an etch mask during the formation of the dummygate stacks. The hard mask layer 210 may include any suitable material,such as a silicon oxide, a silicon nitride, a silicon carbide, a siliconoxynitride, other suitable materials, and/or combinations thereof. Inone embodiment, the hard mask layer 210 includes multiple films, such assilicon oxide and silicon nitride. In some embodiments, the patterningprocess to form the gate stacks includes forming a patterned resistlayer by lithography process; etching the hard mask layer using thepatterned resist layer as an etch mask; and etching the gate materialsto form the gate stacks 208 using the patterned hard mask layer as anetch mask.

One or more gate spacers (not shown) are formed on the sidewalls of thedummy gate stacks 208. The gate spacers may be used to offset thesubsequently formed source/drain features and may be used for designingor modifying the source/drain structure profile. The gate spacers mayinclude any suitable dielectric material, such as a semiconductor oxide,a semiconductor nitride, a semiconductor carbide, a semiconductoroxynitride, other suitable dielectric materials, and/or combinationsthereof. The gate spacers 210 may have multiple films, such as two films(a silicon oxide film and a silicon nitride film) or three films ((asilicon oxide film; a silicon nitride film; and a silicon oxide film).The formation of the gate spacers includes deposition and anisotropicetching, such as dry etching.

The dummy gate stacks 208 are configured on the fin active regions forvarious field effect transistors (FETs), therefore also referred to asFinFETs. Those dummy gate stacks 208 are to be replaced by metal gatesat later fabrication stages. The field effect transistors include n-typetransistors and p-type transistors integrated together. In someexamples, those field effect transistors are configured to form logicgate, such as NOR logic gate, NAND logic gate; memory devices, such asone or more static random access memory (SRAM) cells; other devices,such as I/O devices; or a combination thereof.

The method 100 may proceed to an operation 110 by forming various sourceand drain (not shown) to respective FinFETs. The source and drain mayinclude both light doped drain (LDD) features and heavily doped sourceand drain (S/D). For example, each field effect transistor includessource and drain formed on the respective fin active region andinterposed by the corresponding dummy gate stack 208. A channel isformed in the fin active region in a portion that is underlying thecorresponding gate stack and spans between the source and drain.

The raised source/drain may be formed by selective epitaxy growth forstrain effect with enhanced carrier mobility and device performance. Thedummy gate stacks 208 and the gate spacer constrain the source/drain tothe source/drain regions. In some embodiments, the source/drain areformed by one or more epitaxy processes, whereby Si features, SiGefeatures, SiC features, and/or other suitable features are grown incrystalline state on the fin active regions 206. Alternatively, anetching process is applied to recess the source/drain regions before theepitaxy growth. Suitable epitaxy processes include CVD depositiontechniques (e.g., vapor-phase epitaxy (VPE) and/or ultra-high vacuum CVD(UHV-CVD), molecular beam epitaxy, and/or other suitable processes. Theepitaxy process may use gaseous and/or liquid precursors, which interactwith the composition of the fin active regions 206.

The source and drain may be in-situ doped during the epitaxy process byintroducing doping species including: p-type dopants, such as boron orBF₂; n-type dopants, such as phosphorus or arsenic; and/or othersuitable dopants including combinations thereof. If the source and drainare not in-situ doped, an implantation process (i.e., a junction implantprocess) is performed to introduce the corresponding dopant into thesource and drain. In an exemplary embodiment, the source and drain in annFET include SiC or Si doped with phosphorous, while those in a pFETinclude Ge or SiGe doped with boron. In some other embodiments, theraised source and drain include more than one semiconductor materiallayers. For example, a silicon germanium layer is epitatially grown onthe substrate within the source and drain regions and a silicon layer isepitaxially grown on the silicon germanium layer. One or more annealingprocesses may be performed thereafter to activate the source and drain.Suitable annealing processes include rapid thermal annealing (RTA),laser annealing processes, other suitable annealing technique or acombination thereof.

Referring to FIGS. 5A, 5B and 5C, the method 100 proceeds to anoperation 112 by forming an inter-layer dielectric layer 212 on the finactive regions 206 and the dummy gate stacks 208. FIG. 5A is a top view;FIG. 5B is a sectional view along the dashed line AA′; and FIG. 5C is asectional view along the dashed line BB′ of the semiconductor structure200, in portion, constructed in accordance with some embodiments.

The ILD 212 surround the dummy gate stacks 208 allowing the dummy gatestacks 208 to be removed and replacement gates to be formed in theresulting cavity (also referred to as gate trench). The ILD layer 212may also be part of an electrical interconnect structure thatelectrically interconnects various devices of the semiconductorstructure 200. In such embodiments, the ILD layer 212 acts as aninsulator that supports and isolates the conductive traces. The ILDlayer 212 may include any suitable dielectric material, such as asemiconductor oxide, a semiconductor nitride, a semiconductoroxynitride, other suitable dielectric materials, or combinationsthereof. In some embodiments, the formation of the ILD layer 212includes deposition and CMP to provide a planarized top surface. Thehard mask 210 may be removed at this stage, such as by the CMP or anadditional etching process.

Referring to FIGS. 6A, 6B and 6C, the method 100 proceeds to anoperation 114 by removing the dummy gate stacks 208, resulting in gatetrenches 214 in the ILD layer 212. FIG. 6A is a top view; FIG. 6B is asectional view along the dashed line AA′; and FIG. 6C is a sectionalview along the dashed line BB′ of the semiconductor structure 200, inportion, constructed in accordance with some embodiments. In someembodiments, the gate stacks 208 are removed by an etching process, suchas a wet etch, to selectively remove the gate stacks 208. The etchingprocess may include multiple etching steps to remove the dummy gate ifmore materials present.

Referring to FIGS. 7A, 7B and 7C, the method 100 proceeds to anoperation 116 by forming gate stacks (or gates) 216 in the gate trenches214. FIG. 7A is a top view; FIG. 7B is a sectional view along the dashedline AA′; and FIG. 7C is a sectional view along the dashed line BB′ ofthe semiconductor structure 200, in portion, constructed in accordancewith some embodiments. In the operation 116, the gate stacks 216 areformed with high k dielectric and metal, therefore also referred to ashigh-K metal gate stacks 216. The gate stacks 216 are formed in the gatetrenches 214 by a proper procedure, such as a procedure that includesdeposition and CMP. The gate materials, such as high k dielectricmaterial and metal, are deposited in the gate trenches 214; and a CMPprocess is implemented to polish and remove the excessive gate materialsabove the top surface of the ILD layer 212.

The gate stacks 216 are formed on the substrate 202 overlying thechannel region of the fin active region 206. The gate stacks 216 eachinclude a gate dielectric layer 218 and a gate electrode 220 disposed onthe gate dielectric layer 218. In the present embodiment, the gatedielectric layer 218 includes high-k dielectric material and the gateelectrode 220 includes metal or metal alloy. In some examples, the gatedielectric layer and the gate electrode each may include a number ofsub-layers. The high-k dielectric material may include metal oxide,metal nitride, such as LaO, AlO, ZrO, TiO, Ta₂O₅, Y₂O₃, SrTiO₃ (STO),BaTiO₃ (BTO), BaZrO, HfZrO, HfLaO, HfSiO, LaSiO, AlSiO, HfTaO, HfTiO,(Ba,Sr)TiO₃ (BST), Al₂O₃, or other suitable dielectric materials, suchas Si₃N₄, oxynitrides (SiON).

In some embodiments, the gate dielectric layer 218 is formed on thebottom surface and sidewalls of each gate trench and is U-shaped. Thegate dielectric layer 218 may further includes an interfacial layersandwiched between the high-k dielectric material layer and the finactive region 206. The interfacial layer may include silicon oxide,silicon nitride, silicon oxynitride, and/or other suitable material. Theinterfacial layer is deposited by a suitable method, such as ALD, CVD,ozone oxidation, etc. The high-k dielectric layer is deposited on theinterfacial layer (if the interfacial layer presents) by a suitabletechnique, such as ALD, CVD, metal-organic CVD (MOCVD), PVD, thermaloxidation, combinations thereof, and/or other suitable techniques.

The gate electrode 220 may include Ti, Ag, Al, TiAlN, TaC, TaCN, TaSiN,Mn, Zr, TiN, TaN, Ru, Mo, Al, WN, Cu, W, or any suitable conductivematerial. In some embodiments, different metal materials are used fornFET and pFET devices with respective work functions. The gate electrode220 may include multiple conductive materials. In some embodiments, thegate electrode 220 includes a capping layer, a first blocking layer, awork function metal layer, a second blocking layer and a filling metallayer. In furtherance of the embodiments, the capping layer includestitanium nitride, tantalum nitride, or other suitable material, formedby a proper deposition technique such as ALD. Each of the first andsecond blocking layers includes titanium nitride, tantalum nitride, orother suitable material, formed by a proper deposition technique such asALD. In some examples, the block layers may not present or only one ofthem presents in the gate electrode. The work functional metal layerincludes a conductive layer of metal or metal alloy with proper workfunction such that the corresponding FET is enhanced for its deviceperformance. The work function (WF) metal layer is different for a pFETand a nFET, respectively referred to as an n-type WF metal and a p-typeWF metal. The choice of the WF metal depends on the FET to be formed onthe active region. For example, the semiconductor structure 200 includesa first active region for an nFET and a second active region for a pFET,and accordingly, the n-type WF metal and the p-type WF metal arerespectively formed in the corresponding gate stacks. Particularly, ann-type WF metal is a metal having a first work function such that thethreshold voltage of the associated nFET is reduced. The n-type WF metalis close to the silicon conduction band energy (Ec) or lower workfunction, presenting easier electron escape. For example, the n-type WFmetal has a work function of about 4.2 eV or less. A p-type WF metal isa metal having a second work function such that the threshold voltage ofthe associated pFET is reduced. The p-type WF metal is close to thesilicon valence band energy (Ev) or higher work function, presentingstrong electron bonding energy to the nuclei. For example, the p-typework function metal has a WF of about 5.2 eV or higher. In someembodiments, the n-type WF metal includes tantalum (Ta). In otherembodiments, the n-type WF metal includes titanium aluminum (TiAl),titanium aluminum nitride (TiAlN), or combinations thereof. In otherembodiments, the n-metal include Ta, TiAl, TiAlN, tungsten nitride (WN),or combinations thereof. The n-type WF metal may include variousmetal-based films as a stack for optimized device performance andprocessing compatibility. In some embodiments, the p-type WF metalincludes titanium nitride (TiN) or tantalum nitride (TaN). In otherembodiments, the p-metal include TiN, TaN, tungsten nitride (WN),titanium aluminum (TiAl), or combinations thereof. The p-type WF metalmay include various metal-based films as a stack for optimized deviceperformance and processing compatibility. The work function metal isdeposited by a suitable technique, such as PVD. In various embodiments,the filling metal layer includes aluminum, tungsten or other suitablemetal. The filling metal layer is deposited by a suitable technique,such as PVD or plating.

Thereafter, the gate cut features and dielectric gates are formed on thesubstrate as described below.

Referring to FIGS. 8A, 8B and 8C, the method 100 proceeds to anoperation 118 by performing a gate-cut process to the gate stacks 216.FIG. 8A is a top view; FIG. 8B is a sectional view along the dashed lineAA′; and FIG. 8C is a sectional view along the dashed line BB′ of thesemiconductor structure 200, in portion, constructed in accordance withsome embodiments. For fabrication consideration, such as to improve thepatterning quality and characteristics of the gate stacks 216, the gatestacks 216 are formed with long geometries and then cut to segmentsaccording to the IC design layout. The operation 118 includes patterningthe gate stacks 216 by a procedure that includes lithography patterningand etching. In the present embodiment, the operation 118 includesforming a patterned hard mask 222 on the substrate 202 with openings 224that define the regions of the gate stacks 216 to be cut; and thenperforming an etching process to the gate stacks 216 through theopenings 224 of the hard mask 222 using the hard mask 222 as an etchmask. The operation 118 forms gate-cut openings 226 in the gate stacks216. The hard mask 222 may use any suitable material, such as siliconoxide, silicon nitride, silicon oxynitride, other suitable dielectricmaterial, or a combination thereof. The hard mask 222 is formed bydepositing a hard mask; forming a patterned resist layer by lithography,and etching the hard mask within the openings of the patterned resistlayer. The etching process applied to the gate stacks 216 may includemultiple etching steps with etchants to respective gate materials, andmay include wet etching, dry etching, or a combination thereof.

Referring to FIGS. 9A, 9B and 9C, the method 100 proceeds to anoperation 120 by filling a dielectric material into the gate-cutopenings 226, thereby forming gate-cut dielectric features 230 in thegate-cut openings 226. FIG. 9A is a top view; FIG. 9B is a sectionalview along the dashed line AA′; and FIG. 9C is a sectional view alongthe dashed line BB′ of the semiconductor structure 200, in portion,constructed in accordance with some embodiments. In the presentembodiment, the formation of the gate-cut features 230 includesdeposition and may further include a CMP process after the deposition.The deposition process may deposit any suitable dielectric materialusing a suitable deposition technique, such as CVD, flowable chemicalvapor deposition (FCVD), high density plasma CVD (HDPCVD), othersuitable technique or a combination thereof. After the formation of thegate-cut features 230, the deposited dielectric material may include atop layer 232 remained on the gate stacks 216 and the gate-cut features230. This top layer 232 can be used as a hard mask for the subsequentprocess. In alternative embodiments, after the CMP process, thedeposited dielectric material is planarized to be coplanar with the gatestacks 216; and then a hard mask 232 is deposited on the top surface ofthe semiconductor structure 200.

Referring to FIGS. 10A, 10B and 10C, the method 100 proceeds to anoperation 122 by removing portions of the gate stacks 216 to formtrenches 234. FIG. 10A is a top view; FIG. 10B is a sectional view alongthe dashed line AA′; and FIG. 10C is a sectional view along the dashedline BB′ of the semiconductor structure 200, in portion, constructed inaccordance with some embodiments. In the operation 122, the portions ofthe gate stacks 216 are removed and are to be replaced by dielectricgates. The operation 122 includes patterning the hard mask 232 bylithography process and etching to form a patterned hard mask withopenings 236; and etching to remove the portions of the gate stacks 216within the openings 236, resulting in the trenches 234. In someembodiments illustrated in FIG. 10C, the operation 122 only selectivelyremoves the material(s) of the gate electrode 220 within the openings236 and the gate dielectric layer 218 remains within the trenches 234after the operation 122. Thereafter, the hard mask 232 may be removed,such as by etching.

Referring to FIGS. 11A, 11B and 11C, the method 100 proceeds to anoperation 124 by filling the trenches 234 with a dielectric material 238to form dielectric gates 240. FIG. 11A is a top view; FIG. 11B is asectional view along the dashed line AA′; and FIG. 11C is a sectionalview along the dashed line BB′ of the semiconductor structure 200, inportion, constructed in accordance with some embodiments. In theoperation 124, the dielectric gates 240 are formed to replace theportions of the gate stacks 216. The dielectric gates 240 are dielectricfeatures functioning to provide isolation. The operation 124 includesdeposition and may further include a CMP process. The deposition mayinclude any suitable deposition technique, such as CVD, FCVD, HDPCVD, ora combination thereof. The dielectric gates 240 are different from thegate-cut features 230 in composition for various considerations, such asetching selectivity. The gate-cut features 230 and the dielectric gates240 are both different from the gate dielectric layer 218 incompositions for similar considerations, such as etching selectivity.

As noted above, the gate dielectric layer 218 includes a high-Kdielectric material, or alternatively an interfacial layer of siliconoxide and a high-K dielectric material on the interfacial layer. In someembodiments, each of the gate-cut features 230 and the dielectric gates240 may include silicon oxide, silicon nitride, silicon oxynitride, or acombination thereof but with different composition. For example, thegate-cut features 230 are silicon oxide and the dielectric gates 240 aresilicon nitride. The gate-cut features 230 and the dielectric gates 240may have a multiple layer structure. For example, the gate-cut features230 include a silicon oxide layer and a silicon nitride layer over thesilicon oxide layer while the dielectric gates 240 includes a siliconnitride layer and a silicon oxide layer over the silicon nitride layer.

Thus formed semiconductor structure 200 has one or more dielectric gates240 that have the gate dielectric layer 218 on sidewalls as illustratedin FIG. 11C and further illustrated in FIG. 14. FIG. 14 is a top view ofthe semiconductor structure 200, in portion, constructed in accordancewith some embodiments. Only the fin active regions and the gatestructure are illustrated. The gate dielectric layer 218 is formed onthe sidewalls of the gate electrode 220, and is formed on the sidewallsof the gate-cut features 230 and the sidewalls of the dielectric gates240 as well. Furthermore, the interface between the gate electrode 220and the gate-cut feature 230 is free of the gate dielectric layer 218,which leading to increased dimension of the gate electrode 220 andimproved device performance. In the present embodiment, the gateelectrode 220 in the central location of FIG. 14 is interposed by thegate-cut features 230, which is further interposed by the dielectricgate 240. All are aligned to form a continuous structure that iscompletely surrounded by the gate dielectric layer 218.

In other embodiments, the operation 122 removes both the gate dielectriclayer 218 and the gate electrode 220 within the trenches 234, asillustrated in FIGS. 12A, 12B and 12C. After filling the trenches 234with a dielectric material 238 by the operation 124, the dielectricgates 240 are formed as illustrated in FIGS. 13A, 13B and 13C. Thusformed dielectric gates 240 have a structure different from that of FIG.11C. In FIG. 13C, the gate dielectric layer 218 is not present on theouter sidewalls of the dielectric gates 240 and the dielectric gates 240directly contact the ILD layer 212 from the outer sidewalls.

Furthermore, if the operation 118 removes both the gate dielectric layer218 and the gate electrode 220 within the trenches 226, then thegate-cut features 230 are also free of the gate dielectric layer 218 onthe outer sidewalls. Thus formed semiconductor structure 200 is furtherillustrated in FIG. 15. FIG. 15 is a top view of the semiconductorstructure 200, in portion, constructed in accordance with someembodiments. Only the fin active regions and the gate structure areillustrated. The gate dielectric layer 218 is formed on the sidewalls ofthe gate electrode 220 but the dielectric gates 240 and the gate-cutfeatures 230 are free of the gate dielectric layer 218 on respectiveouter sidewalls. Furthermore, the interface between the gate electrode220 and the gate-cut feature 230 is free of the gate dielectric layer218, which leading to increased dimension of the gate electrode 220 andimproved device performance. In the present embodiment, the gateelectrodes 220 in the central location of FIG. 15 is interposed by thegate-cut features 230, which is further interposed by the dielectricgate 240. All are aligned to form a continuous structure, and the gateelectrodes 220 are protected by the gate dielectric layer 218 onrespective outer sidewalls. Accordingly, the gate-cut features 230 andthe dielectric gates 240 span a greater dimension along the Y directionthan that of the gate electrodes 220.

The semiconductor structure 200 and the method 100 making the same arecollectively described above in accordance with various embodiments.There are variations and alternatives within the scope of the presentdisclosure. For example, the formation of the gate-cut features 230 andthe dielectric gates 240 may have a different sequence. For example, thedielectric gates 240 are formed and the gate-cut features 230 are formedthereafter. However, both are formed after the formation of the gatestacks 216. In this case, the operations 122 and 124 are implementedbefore the operations 118 and 120 but after the operations 114 and 116.In another embodiment, the gate-cut features 230 and the dielectricgates 240 are formed simultaneously by a collective procedure, such asone patterning to define both the openings for both the dielectric gates240 and the gate-cut features 230 with reduced manufacturing cost. Bothare further described below.

In one embodiment illustrated in FIG. 16, the gate-cut features 230 areformed by a first lithography process using a mask pattern with openings224 (such as the hard mask openings 224 in the operation 118 illustratedin FIG. 8A) and the dielectric gates 240 are formed by a secondlithography process using a mask pattern with openings 236 (such as thehard mask openings 236 in the operation 122 illustrated in FIG. 10A).

In an alternative embodiment illustrated in FIG. 17, the gate-cutfeatures and the dielectric gates are collectively defined by a singlemask pattern with openings 246 and are defined by a single lithographyprocess. Thus, the gate-cut features and the dielectric gates aresimultaneously formed in a single procedure that includes lithographypatterning, etching and deposition. Accordingly, the gate-cut featuresand the dielectric gates include a same composition and are collectivelyreferred with numeral 248 in FIG. 17.

The present disclosure provides the semiconductor structure 200 and themethod 100 making the same in accordance with various embodiments. Themethod forms the gate-cut features 230 and the dielectric gates 240after the formation of the high-K metal gate stacks 216. Variousadvantages may present in various embodiments. By utilizing thedisclosed method, the interface between the gate electrode 220 and thegate-cut feature 230 (or the dielectric gate 240) is free of the gatedielectric layer 218, which leading to increased dimension of the gateelectrode 220 and improved device performance. The formation of thedielectric gates 240 and the formation of the gate-cut features 230 bothare self-aligned processes with better alignment and improved deviceperformance.

Thus, the present disclosure provides a semiconductor structure inaccordance with some embodiments. The semiconductor structure includes afin active region extruded from a semiconductor substrate; and a gatestack disposed on the fin active region. The gate stack includes a gatedielectric layer and a gate electrode disposed on the gate dielectriclayer. The gate dielectric layer includes a first dielectric material.The semiconductor structure further includes a dielectric gate of asecond dielectric material disposed on the fin active region. The gatedielectric layer extends from a sidewall of the gate electrode to asidewall of the dielectric gate. The second dielectric material isdifferent from the first dielectric material in composition.

The present disclosure provides a semiconductor structure in accordancewith other embodiments. The semiconductor structure includes a finactive region extruded from a semiconductor substrate; a gate stackdisposed on the fin active region, wherein the gate stack includes agate dielectric layer and a gate electrode disposed on the gatedielectric layer; and a dielectric gate of a first dielectric materialdisposed on the fin active region. The gate dielectric layer includes asecond dielectric material being different from the first dielectricmaterial in composition. The gate dielectric layer is disposed on afirst sidewall of the gate electrode and is free from a second sidewallof the gate electrode.

The present disclosure also provides a method of forming an integratedcircuit structure in accordance with some embodiments. The methodincludes forming a plurality of fin active regions on a semiconductorsubstrate; forming a dummy gate stack on the fin active regions; formingan inter-layer dielectric (ILD) layer in gaps between the dummy gatestacks; removing the dummy gate stack to form a first trench in the ILDlayer; filling the first trench by depositing a gate dielectric layer ofa first dielectric material and depositing a conductive material layeron the gate dielectric layer, thereby forming a high-K metal gate stack;performing a first patterning process to the conductive material layerto form a second trench; filling the second trench with a seconddielectric material being different from the first dielectric materialin composition; performing a second patterning process to the conductivematerial layer to form a third trench; and filling the third trench witha third dielectric material being different from the first and seconddielectric material in composition.

The foregoing has outlined features of several embodiments. Thoseskilled in the art should appreciate that they may readily use thepresent disclosure as a basis for designing or modifying other processesand structures for carrying out the same purposes and/or achieving thesame advantages of the embodiments introduced herein. Those skilled inthe art should also realize that such equivalent constructions do notdepart from the spirit and scope of the present disclosure, and thatthey may make various changes, substitutions and alterations hereinwithout departing from the spirit and scope of the present disclosure.

What is claimed is:
 1. A semiconductor structure, comprising: a finactive region extruded from a semiconductor substrate; a gate stackdisposed on the fin active region, wherein the gate stack includes agate dielectric layer and a gate electrode disposed on the gatedielectric layer, wherein the gate dielectric layer includes a firstdielectric material; and a dielectric gate of a second dielectricmaterial disposed on the fin active region, wherein the gate dielectriclayer extends from a sidewall of the gate electrode to a sidewall of thedielectric gate, wherein the gate electrode and the dielectric gate arespaced apart from each other such that the gate electrode does notinterface with the dielectric gate, and wherein the second dielectricmaterial is different from the first dielectric material in composition.2. The semiconductor structure of claim 1, further comprising a gate-cutfeature of a third dielectric material interposed between the gateelectrode and the dielectric gate, wherein the third dielectric materialis different from at least one of the first dielectric material andsecond dielectric material in composition.
 3. The semiconductorstructure of claim 2, wherein the gate dielectric layer is disposed on asidewall of the gate-cut feature.
 4. The semiconductor structure ofclaim 2, wherein an interface between the gate electrode and thegate-cut feature is free of the gate dielectric layer.
 5. Thesemiconductor structure of claim 3, wherein the gate-cut featurecontacts the gate electrode at a first end and contacts the dielectricgate at a second end being opposite the first end.
 6. The semiconductorstructure of claim 5, wherein the gate dielectric layer is a continuousfeature extending from the sidewall of the gate electrode, through thesidewall of the gate-cut feature, and to the sidewall of the dielectricgate.
 7. The semiconductor structure of claim 1, wherein the gateelectrode includes metal and the gate dielectric layer includes a high-kdielectric material.
 8. A semiconductor structure, comprising: a finactive region extruded from a semiconductor substrate; a gate stackdisposed on the fin active region, wherein the gate stack includes agate dielectric layer and a gate electrode disposed on the gatedielectric layer; and a dielectric gate of a first dielectric materialdisposed on the fin active region, wherein the gate dielectric layerincludes a second dielectric material being different from the firstdielectric material in composition, and the gate dielectric layer isdisposed on a first sidewall of the gate electrode without beingdisposed on a second sidewall of the gate electrode.
 9. Thesemiconductor structure of claim 8, wherein all sidewalls of thedielectric gate are free of the gate dielectric layer.
 10. Thesemiconductor structure of claim 8, further comprising a gate-cutfeature of a third dielectric material interposed between the gateelectrode and the dielectric gate, wherein the third dielectric materialis different from at least one of the first dielectric material andsecond dielectric material in composition.
 11. The semiconductorstructure of claim 10, wherein the gate electrode directly contacts thegate-cut feature.
 12. The semiconductor structure of claim 10, whereinthe gate dielectric layer includes a high-k dielectric material and thegate electrode includes metal.
 13. The semiconductor structure of claim12, wherein the first dielectric material includes silicon oxide and thethird dielectric material includes silicon nitride.
 14. Thesemiconductor structure of claim 8, further comprising ashallow-trench-isolation (STI) feature formed on the semiconductorsubstrate and contacting the dielectric gate.
 15. A semiconductorstructure, comprising: a fin active region extruded from a semiconductorsubstrate; a gate stack disposed on the fin active region, wherein thegate stack includes a gate dielectric layer and a gate electrodedisposed on the gate dielectric layer, wherein the gate dielectric layerincludes a first dielectric material; a dielectric gate of a seconddielectric material disposed on the fin active region; and a gate-cutfeature of a third dielectric material interposed between the gateelectrode and the dielectric gate, wherein the gate dielectric layercontinuously extends to cover a first sidewall surface of the gateelectrode, a first sidewall surface of the gate-cut feature, and a firstsidewall surface of the dielectric gate, and each of the second andthird dielectric materials is different from the first dielectricmaterial in composition.
 16. The semiconductor structure of claim 15,wherein the gate-cut feature contacts the gate electrode at a first endand contacts the dielectric gate at a second end being opposite thefirst end.
 17. The semiconductor structure of claim 16, wherein the gateelectrode has a rectangle shape with three sidewall surfacescontinuously covered by the gate dielectric layer, and the gateelectrode includes a second sidewall surfaces contacting the gate-cutfeature and being free of the gate dielectric layer.
 18. Thesemiconductor structure of claim 17, wherein the dielectric gate isrectangle-shaped and includes a second sidewall surface contacting thegate-cut feature and being free of the gate dielectric layer.
 19. Thesemiconductor structure of claim 15, wherein the gate electrode includesmetal, the first dielectric material includes a high-k dielectricmaterial, the second dielectric material includes silicon oxide, and thethird dielectric material includes silicon nitride.
 20. Thesemiconductor structure of claim 15, further comprising ashallow-trench-isolation (STI) feature formed on the semiconductorsubstrate and contacting the dielectric gate.